A three-dimensional thermal analysis and optimization of square light edding diode subcomponents
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DOI: 10.1016/j.icheatmasstransfer.2020.105016
Abstract: Abstract The purpose of this paper is to assess thermal management and optimization of several parameters such as: materials, size and thickness of all subcomponents of single-chip Light Emitting Diode (LED) in order to minimize… read more here.
Keywords: three dimensional; diode; thermal analysis; dimensional thermal ... See more keywords