Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy
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DOI: 10.3390/ma16010096
Abstract: This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning… read more here.
Keywords: copper; solder; copper substrate; dimple ... See more keywords