Light enhanced direct Cu bonding for advanced electronic assembly
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9547-5
Abstract: An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnetic radiation exposure on faying… read more here.
Keywords: electronic assembly; enhanced direct; direct bonding; light enhanced ... See more keywords
AlN-to-Metal Direct Bonding Process Utilizing Sintering of Ag Nanoparticles Derived from the Reduction of Ag2O
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6504-2
Abstract: Bonding between AlN and metals conventionally requires a surface modification process at high temperature such as metallization. The AlN-to-metal direct bonding process by sintering of Ag nanoparticles derived from in situ reduction of Ag2O microparticles… read more here.
Keywords: aln metal; direct bonding; process; bonding process ... See more keywords
Indirect vs direct bonding of mandibular fixed retainers in orthodontic patients: Comparison of retainer failures and posttreatment stability. A 2‐year follow‐up of a single‐center randomized controlled trial
Sign Up to like & getrecommendations! Published in 2017 at "American Journal of Orthodontics and Dentofacial Orthopedics"
DOI: 10.1016/j.ajodo.2016.09.009
Abstract: Introduction The objectives of this 2‐arm parallel trial were to compare the numbers of failures of mandibular fixed retainers bonded with indirect and direct methods and to investigate the posttreatment changes 2 years after placement.… read more here.
Keywords: trial; fixed retainers; direct bonding; mandibular fixed ... See more keywords
Glass-on-LiNbO3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method
Sign Up to like & getrecommendations! Published in 2018 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2018.08.031
Abstract: Abstract Lithium niobate (LiNbO3) crystal has been widely used in integrating optical and acoustic devices. However, direct bonding of LiNbO3 to Si-based materials is still a challenge due to the large coefficient of thermal expansion… read more here.
Keywords: microscopy; glass; plasma activated; direct bonding ... See more keywords
A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation
Sign Up to like & getrecommendations! Published in 2019 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2018.11.239
Abstract: Abstract Single-crystalline silicon carbide is an attractive material for power electronics. However, it is difficult to achieve the direct bonding of SiC to conventional Si-based materials (e.g., Si, SiO2, and glass) due to the large… read more here.
Keywords: sic sio2; single crystalline; vuv irradiation; direct bonding ... See more keywords
Direct bonding of silicon carbide with hydrofluoric acid treatment for high-temperature pressure sensors
Sign Up to like & getrecommendations! Published in 2020 at "Ceramics International"
DOI: 10.1016/j.ceramint.2019.10.123
Abstract: Abstract Direct bonding of single-crystal silicon carbide (SiC) is a critical process for the fabrication of pressure sensors used in harsh environments. In this paper, we present a direct bonding process with a surface treatment… read more here.
Keywords: treatment; bonding; direct bonding; hydrofluoric acid ... See more keywords
CO bond enhancing direct bonding strength between plastic and pure titanium
Sign Up to like & getrecommendations! Published in 2018 at "Materials Letters"
DOI: 10.1016/j.matlet.2017.10.042
Abstract: Abstract Direct bonding process by using the conventional hot pressing was applied to prepare the dissimilar materials consisting of the thermoplastic resin and pure titanium (Ti) material. In employing the pressing temperature at the melting… read more here.
Keywords: pure; bonding strength; bonding; pure titanium ... See more keywords
High-temperature direct bonding of langasite using oxygen plasma activation
Sign Up to like & getrecommendations! Published in 2021 at "Scripta Materialia"
DOI: 10.1016/j.scriptamat.2020.113681
Abstract: Abstract A plasma-activated direct bonding method of langasite at 1000 °C under the pressure of 6 MPa has been achieved. The optimized plasma parameter analyzed by the infrared spectroscopy is oxygen 200 W for 45 s. According to… read more here.
Keywords: oxygen plasma; plasma activation; plasma; direct bonding ... See more keywords
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
Sign Up to like & getrecommendations! Published in 2017 at "Scientific Reports"
DOI: 10.1038/s41598-018-32280-x
Abstract: A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth… read more here.
Keywords: copper; oriented nanotwinned; direct bonding; vacuum ... See more keywords
Crystallographic characterization of Y2C2n (2n = 82, 88–94): direct Y–Y bonding and cage-dependent cluster evolution
Sign Up to like & getrecommendations! Published in 2019 at "Chemical Science"
DOI: 10.1039/c9sc00941h
Abstract: The long-sought Y–Y bonding is experimentally observed in organometallic complexes for the first time by encapsulation inside the hollow cavity of C3v(8)-C82 and Cs(6)-C82 fullerene cages. read more here.
Keywords: y2c2n direct; cage dependent; characterization y2c2n; direct bonding ... See more keywords
Heterogeneous direct bonding of diamond and semiconductor substrates using NH3/H2O2 cleaning
Sign Up to like & getrecommendations! Published in 2020 at "Applied Physics Letters"
DOI: 10.1063/5.0026348
Abstract: A diamond (111) substrate cleaned with an NH3/H2O2 mixture could form low-temperature direct bonding under atmospheric conditions. When the diamond surface was bonded with a plasma activated SiO2 surface at 200 °C, the bonding strength was… read more here.
Keywords: bonding diamond; heterogeneous direct; direct bonding; nh3 h2o2 ... See more keywords