Direct ink writing of 3D cavities for direct plated copper ceramic substrates with kaolin suspensions
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DOI: 10.1016/j.ceramint.2019.03.191
Abstract: Abstract The development of three-dimensional kaolin-based materials cavities for direct plated copper (3DPC) ceramic substrates has great promising in hermetic and ultraviolet light emitting diodes electronic packaging field. In this study, suspensions with kaolin clay… read more here.
Keywords: kaolin suspensions; kaolin; direct plated; ceramic substrates ... See more keywords