Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing
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DOI: 10.3390/mi13111856
Abstract: Direct wafer bonding is one of the most attractive techniques for next-generation semiconductor devices, and plasma has been playing an indispensable role in the wider adoption of the wafer bonding technique by lowering its process… read more here.
Keywords: direct wafer; wafer; temperature; wafer bonding ... See more keywords