Influence of additives on Cu thin films electrodeposited directly on Ti diffusion barrier in Cl-free electrolytes for Cu interconnect
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DOI: 10.1016/j.mee.2017.02.006
Abstract: For Cu interconnect in Si-based microelectronic devices, seedless electrodeposition of Cu thin films directly on Ti diffusion barrier was investigated in Cl-free, citrate (Cit)-based acidic electrolytes with polyethylene glycol (PEG) or Janus Green B (JGB)… read more here.
Keywords: thin films; surface; directly diffusion; diffusion barrier ... See more keywords