Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants
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DOI: 10.1007/s10765-018-2397-9
Abstract: AbstractWith the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn–3Ag–0.5Cu–xP solder alloys, with various drop sizes as well as different phosphorus (P) content,… read more here.
Keywords: dorsey method; containing surfactants; solder; surface tension ... See more keywords