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Published in 2019 at "Microelectronic Engineering"
DOI: 10.1016/j.mee.2019.111025
Abstract: Abstract In order to reduce bombardment or chemical etching damage of Ge pMOSFET treated by F-based plasma, an additional O2 or/and N2 plasma treatment was applied on the high-k gate dielectric in this work. The…
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Keywords:
based double;
double plasma;
reliability characteristics;
plasma treatment ... See more keywords