Research on the Influence Mechanism of Thermal Load on the Au-Sn Sealing Weld State on Three-Dimensional DPC Substrates
Sign Up to like & getrecommendations! Published in 2025 at "Materials"
DOI: 10.3390/ma18153678
Abstract: Direct copper-plated ceramic (DPC) substrates have emerged as a favored solution for power device packaging due to their unique technical advantages. AuSn, characterized by its high hermeticity and environmental adaptability, represents the optimal sealing technology… read more here.
Keywords: weld seam; research influence; dpc substrates; dpc ... See more keywords