Effect of thermal misfit stress on steam-driven delamination in electronic packages
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DOI: 10.1016/j.engfracmech.2018.03.008
Abstract: Abstract In this study, circular interfacial defects or delaminations between the die-attach layer and the substrate in electronic packages are analytically modeled to investigate the effect of thermal misfit stress on the steam-driven delamination during… read more here.
Keywords: driven delamination; steam driven; stress; electronic packages ... See more keywords