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1
Published in 2019 at "Biomedical Microdevices"
DOI: 10.1007/s10544-019-0379-8
Abstract: Polydimethylsiloxane (PDMS) has been the pivotal materials for microfluidic technologies with tremendous amount of lab-on-a-chip devices made of PDMS microchannels. While molding-based soft-lithography approach has been extremely successful in preparing various PDMS constructs, some complex…
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Keywords:
polydimethylsiloxane pdms;
young modulus;
rate;
pdms ... See more keywords
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1
Published in 2019 at "Plasma Chemistry and Plasma Processing"
DOI: 10.1007/s11090-019-10025-6
Abstract: In this study, the dry plasma-chemical etching process of monocrystalline SiO 2 (quartz) in a fluoride-based (sulfur hexafluoride, SF 6 ) inductively coupled plasma (ICP) was investigated. The etching rate ( V etch ) dependencies…
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Keywords:
icp;
temperature;
quartz;
etch ... See more keywords
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2
Published in 2023 at "Applied Physics Letters"
DOI: 10.1063/5.0138736
Abstract: In this study, we dry etched SiO2-masked (001) β-Ga2O3 substrates in HCl gas flow at a high temperature without plasma excitation. The etching was done selectively in window areas to form holes or trenches with…
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Keywords:
hcl gas;
ga2o3 substrates;
001 ga2o3;
dry etching ... See more keywords
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1
Published in 2018 at "Nanotechnology"
DOI: 10.1088/1361-6528/aaa933
Abstract: In this study, we demonstrate a new method to selectively etch the point defects or the boundaries of as-grown hexagonal boron nitride (hBN) films and flakes in situ on copper substrates using hydrogen and argon…
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Keywords:
microscopy;
defect selective;
boron nitride;
hexagonal boron ... See more keywords
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Published in 2019 at "Nanotechnology"
DOI: 10.1088/1361-6528/ab4079
Abstract: PCM (phase-change memory) is an important class of data storage, operating based on the Joule heating-induced reversible switching of chalcogenide alloys. Nanoscale PCM often requires advanced microfabrication techniques such as dry (plasma) etching, but the…
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Keywords:
effect dry;
phase change;
change memory;
change ... See more keywords
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0
Published in 2021 at "IEEE Transactions on Nanotechnology"
DOI: 10.1109/tnano.2021.3115509
Abstract: Germanium tin (GeSn) with a Sn content of >12% has a great potential for optoelectronic devices due to its direct bandgap property. In this work, the anisotropic etching of GeSn with Sn content of 12.5%…
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Keywords:
plasma;
gesn;
dry etching;
germanium tin ... See more keywords
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Published in 2020 at "Semiconductors"
DOI: 10.1134/s1063782620010108
Abstract: Abstract Methods of micro-profiling of 4 H -SiC are described: formation of mesa structures with inclined walls (off-vertical wall inclination angle exceeding 45°) by reactive ion etching; etching of mesa structures with a flat bottom…
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Keywords:
profiling sic;
micro profiling;
form schottky;
etching form ... See more keywords
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1
Published in 2022 at "ECS Journal of Solid State Science and Technology"
DOI: 10.1149/2162-8777/ac94a0
Abstract: Patterning of NiO/Ga2O3 heterojunctions requires development of selective wet and dry etch processes. Solutions of 1:4 HNO3:H2O exhibited measurable etch rates for NiO above 40°C and activation energy for wet etching of 172.9 kJ.mol-1 (41.3…
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Keywords:
selective wet;
wet dry;
dry etching;
etching nio ... See more keywords
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2
Published in 2023 at "Micromachines"
DOI: 10.3390/mi14020306
Abstract: The silicon etching process is a core component of production in the semiconductor industry. Undercut is a nonideal effect in silicon dry etching. A reduced undercut is desired when preparing structures that demand a good…
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Keywords:
effect;
mask;
dry etching;
silicon ... See more keywords
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Published in 2022 at "Nanomaterials"
DOI: 10.3390/nano12162836
Abstract: The exceptional material properties of Lithium Niobate (LiNbO3) make it an excellent material platform for a wide range of RF, MEMS, phononic and photonic applications; however, nano-micro scale device concepts require high fidelity processing of…
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Keywords:
surface;
plasma;
treatment;
high quality ... See more keywords