Optimizing fin design for a PCM-based thermal storage device using dynamic Kriging
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DOI: 10.1016/j.ijheatmasstransfer.2017.12.143
Abstract: Abstract A key challenge in the development of a practical thermal storage device (TSD) is the low thermal conductivity of common phase change materials (PCM). This low conductivity impedes both heat input and extraction. The… read more here.
Keywords: thermal storage; dynamic kriging; storage device; design ... See more keywords