Dynamic warpage simulation of molded PCB under reflow process
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DOI: 10.1108/cw-02-2021-0061
Abstract: Purpose This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpage behavior for different form factor sizes. Design/methodology/approach This study analyzes… read more here.
Keywords: temperature; process; molded pcb; warpage ... See more keywords