Guest Editorial for IRSP 2018 Conference
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2018.2881614
Abstract: Stress is always an important factor in designing next generations of electronics devices and systems. It certainly has been paramount for the success of the microelectronics industry and the next generations of 3D Integrated Circuits… read more here.
Keywords: 2018 conference; guest editorial; devices systems; editorial irsp ... See more keywords