The effect of finish layer on the interfacial cracking failure of Au Si bonding
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DOI: 10.1016/j.engfailanal.2020.104682
Abstract: Abstract The interfacial reliability of Au-Si bonding between Cu/MoCu/Cu (named as CPC) substrate and silicon chip is analyzed. The results of optical microscopy (OM) and conformal laser scanning microscopy (CLSM) revealed that the Au layer… read more here.
Keywords: finish layer; microscopy; layer; nico layer ... See more keywords