Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints
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DOI: 10.1007/s10854-020-03695-y
Abstract: Effects of the Ni(P) plating thickness on interfacial reaction in the Sn–58Bi/Ni(P)/Cu joint system were revealed. It was found that the interfacial reaction was significantly influenced by the thickness of Ni(P) plating, and 0.1 μm Ni(P)… read more here.
Keywords: snp layer; effects plating; plating thickness; solder ... See more keywords