Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5883-0
Abstract: The effects of solder volume and reaction time between molten solder and a metal pad at the peak temperature of reflow on the self-alignment effect have been investigated in flip chip bonding. A glass die… read more here.
Keywords: effects solder; volume; solder volume; pad ... See more keywords