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Published in 2017 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.7b02214
Abstract: Adhesion between a stamp with an elastomeric layer and various devices or substrates is crucial to successfully fabricate flexible electronics using a transfer process. Although various transfer processes using stamps with different adhesion strengths have…
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Keywords:
elastomeric layer;
layer;
adhesion;
transfer process ... See more keywords