Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias
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DOI: 10.1016/j.microrel.2019.113512
Abstract: Abstract Sidewall scallops of through-silicon-vias (TSVs) formed during the Bosch etching process will bring serious challenges to TSV reliability. In this paper, the impact of sidewall scallops on the electric-thermo-mechanical reliability of TSVs is investigated,… read more here.
Keywords: electric thermo; silicon vias; scallop induced; thermo mechanical ... See more keywords