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Published in 2021 at "Applied Physics Letters"
DOI: 10.1063/5.0065658
Abstract: A thermal-assisted electroforming (TAE) method is proposed to address the current overshoot issue and improve the resistive switching (RS) performance of electrochemical metallization (ECM) memory with a Cu/amorphous carbon (a-C)/Pt structure. In the initial electroforming…
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Keywords:
assisted electroforming;
electrochemical metallization;
performance;
overshoot current ... See more keywords