Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7806-5
Abstract: The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of operating circuits and results in shorts (dendrites) between adjacent conductor lines/traces. Dendrite growth occurs as a result of metal ions… read more here.
Keywords: enig surface; surface; electrochemical migration; test ... See more keywords
Analyses and design for electrochemical migration suppression by alloying indium into silver
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9520-3
Abstract: Silver electrochemical migration (ECM) is a serious reliability issue for fine pitch as well as power electronic devices that employ silver as interconnection materials. In this study, a method to suppress the ECM behavior of… read more here.
Keywords: analyses design; electrochemical migration; migration; ecm ... See more keywords
Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-00858-4
Abstract: The effect of HSO3− on the electrochemical migration (ECM) of Sn–3.0Ag–0.5Cu lead-free solder alloy under thin electrolyte layers was investigated using the thin electrolyte layer method. The results showed that the migration element of Sn–3.0Ag–0.5Cu… read more here.
Keywords: electrolyte layers; alloy; 0ag 5cu; thin electrolyte ... See more keywords
Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2021.158726
Abstract: Abstract Problems associated with the oxidation of Cu nanopaste have been widely studied in efforts to develop a replacement for Ag nanopaste. The intensive pulsed light (IPL) sintering process has been suggested to solve the… read more here.
Keywords: migration behavior; nanopaste; electrochemical migration; pulse power ... See more keywords
In-situ study of electrochemical migration of tin in the presence of bromide ion.
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DOI: 10.1038/s41598-021-95276-0
Abstract: The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the… read more here.
Keywords: tin presence; electrochemical migration; presence bromide; presence ... See more keywords
On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?
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DOI: 10.3390/ma14185237
Abstract: Electrochemical migration (ECM) forming dendritic short circuits is a major reliability limiting factor in microcircuits. Gold, which is a noble metal, has been regarded as a metallization that can withstand corrosion and also ECM, therefore… read more here.
Keywords: electrochemical migration; migration mechanism; gold; gold electronics ... See more keywords