Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0423-0
Abstract: In this work, the interfacial reactions and IMC growth of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu were studied during reflowing at 220 °C for 10 min and solid–state treatment at 150 °C with various aging times. For… read more here.
Keywords: layer; electroless plating; 35bi 1ag; plating layer ... See more keywords
Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-04543-9
Abstract: To enhance the effects of electroless Ni–P plating on inhibiting atom diffusion in Sn-58Bi joint systems, adding nano-sized metals into coating was regarded as an efficient method. Therefore, Cu nanoparticles were chosen as the additive… read more here.
Keywords: interfacial microstructure; evolution solder; solder joints; electroless plating ... See more keywords
Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6335-1
Abstract: The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface between the solder and metal pad. Contamination in electroless Ni plating solutions… read more here.
Keywords: mto; plating solutions; mto solutions; electroless plating ... See more keywords
Bio-inspired Fabrication of Cu-Ni Coatings onto Mercerized Flax Fabric by Electroless Plating
Sign Up to like & getrecommendations! Published in 2020 at "Fibers and Polymers"
DOI: 10.1007/s12221-020-9223-2
Abstract: This research mainly prepared a bio-friendly electromagnetic interference (EMI) shielding fabric, and discussed the influence of the grammage (i.e. 120 g/m 2 , 160 g/m 2 and 210 g/m 2 , etc) of fabric substrate… read more here.
Keywords: fabric; fabric electroless; electroless plating; spectroscopy ... See more keywords
The Importance of Electroless Metallic Build-Up on Surface Modified Substrates for Multifunctional Engineering Applications: A Recent Progress Update
Sign Up to like & getrecommendations! Published in 2018 at "Transactions of the Indian Institute of Metals"
DOI: 10.1007/s12666-018-1397-6
Abstract: Electroless plating is a widely used methodology adopted by the industries as well as the academia as it permits the deposition of the metal onto various substrates like metals, ceramics or polymer devoid the usage… read more here.
Keywords: importance electroless; electroless plating; electroless; engineering applications ... See more keywords
Volatile organic compounds (VOCs) removal using ACFs with electroless plating CuO as catalysts
Sign Up to like & getrecommendations! Published in 2020 at "Carbon Letters"
DOI: 10.1007/s42823-020-00140-2
Abstract: Activated carbon fibers (ACFs) were treated by electroless plating of CuO to improve their removal performance for volatile organic compounds (VOCs). The properties of these samples(CuO@ACFs) were evaluated by X-ray photoelectron spectroscopy (XPS), BET and… read more here.
Keywords: organic compounds; plating cuo; volatile organic; removal ... See more keywords
Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Sign Up to like & getrecommendations! Published in 2017 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2016.09.152
Abstract: Abstract A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and… read more here.
Keywords: copper; copper patterns; electroless plating; conductive copper ... See more keywords
Comparative study of electroless Co-Ni-P plating on Tencel fabric by Co 0 -based and Ni 0 -based activation for electromagnetic interference shielding
Sign Up to like & getrecommendations! Published in 2017 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2017.04.176
Abstract: Abstract The primary objective of this research work was to develop high-performance conductive fabrics with desired electromagnetic interference (EMI) shielding effectiveness (SE), excellent durability and improved corrosion resistance. Such conductive fabrics were fabricated by combining… read more here.
Keywords: aptms; electromagnetic interference; electroless plating; activation ... See more keywords
Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds
Sign Up to like & getrecommendations! Published in 2021 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2021.149220
Abstract: Abstract Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive polyethylene terephthalate (PET) substrate by combining the inkjet print with copper nanoparticles (Cu NPs) conductive ink… read more here.
Keywords: electroless plating; copper; fabrication flexible; copper patterns ... See more keywords
Preparation of Co-plated WC powders by a non-precious-Co-activation triggered electroless plating strategy
Sign Up to like & getrecommendations! Published in 2019 at "Advanced Powder Technology"
DOI: 10.1016/j.apt.2019.07.012
Abstract: Abstract In this study, Co nanoparticles were mixed with WC powders by electroless plating with a new non-precious-Co-activation strategy. By soaking WC powders in a mixed solution of cobalt sulfate heptahydrate and sodium hypophosphite and… read more here.
Keywords: electroless plating; strategy; precious activation; preparation plated ... See more keywords
Efficient degradation of atrazine by Co-NZ catalyst prepared by electroless plating in the presence of peroxymonosulfate: Characterization, performance and mechanistic consideration
Sign Up to like & getrecommendations! Published in 2019 at "Chemical Engineering Journal"
DOI: 10.1016/j.cej.2018.11.049
Abstract: Abstract A heterogeneous catalyst, cobalt-modified natural zeolite prepared by electroless plating technique (ECM-Co-NZ), was fabricated as a peroxymonosulfate (PMS) activator for enhancing the oxidative degradation of atrazine (ATZ) in aqueous media. SEM, EDS, BET, XRD,… read more here.
Keywords: electroless plating; catalyst; degradation atrazine; prepared electroless ... See more keywords