Peptide mapping of proteins by capillary electromigration methods.
Sign Up to like & getrecommendations! Published in 2022 at "Journal of separation science"
DOI: 10.1002/jssc.202200664
Abstract: This review article provides a wide overview of important developments and applications of capillary electromigration methods in the area of peptide mapping of proteins in the period 1997-mid 2022, including review articles on this topic.… read more here.
Keywords: capillary electromigration; electromigration methods; proteins capillary; electromigration ... See more keywords
Effects of graphene oxide on the electromigration lifetime of lead-free solder joints
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0506-y
Abstract: Electromigration (EM) is the mass transport of atoms due to electron flow, which induces a disconnect in electronic packaging. Recently, EM has received growing attention because it occurs easily when the size of joints in… read more here.
Keywords: graphene oxide; solder joints; electromigration; lifetime ... See more keywords
Interfacial evolution in Sn–58Bi solder joints during liquid electromigration
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-8907-5
Abstract: For Sn–58Bi low temperature solder alloy, local molten induced from electromigration Joule heating might change the atomic diffusion and interfacial behavior. In this paper, the diffusion behavior and interfacial evolution of Cu/Sn–58Bi/Cu joints were studied… read more here.
Keywords: interfacial evolution; electromigration; molten solder; solder ... See more keywords
Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6786-4
Abstract: Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of intermetallic compounds. This failure mode is reported to be a result… read more here.
Keywords: imc growth; electromigration; intermetallic compounds; thermomigration ... See more keywords
Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-020-08514-y
Abstract: Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced significantly. This trend currently leads to an increased amount of current density… read more here.
Keywords: oriented failure; flip chip; electromigration; electromigration oriented ... See more keywords
Irregular bending growth of free-standing Al microwire by electromigration
Sign Up to like & getrecommendations! Published in 2018 at "Acta Materialia"
DOI: 10.1016/j.actamat.2018.07.026
Abstract: Abstract Electromigration (EM) can generate free-standing micro- and nanowires that are occasionally irregularly bent to kinked and curved or collapsed shapes. The mechanism behind irregular bending was discussed based on electron microscopy data. Al microwires… read more here.
Keywords: free standing; electromigration; wire; growth rate ... See more keywords
Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM
Sign Up to like & getrecommendations! Published in 2021 at "Acta Materialia"
DOI: 10.1016/j.actamat.2021.117250
Abstract: Abstract Electromigration (EM) has aroused substantial attention with the shrinkage of modern devices. EM is an interaction between electron carriers and atoms, meaning that it arises from atomic behaviour. Both the number of twin boundaries… read more here.
Keywords: scale investigation; atomic scale; hrtem; electron flow ... See more keywords
Lithium isotope separation by electromigration
Sign Up to like & getrecommendations! Published in 2020 at "Chemical Physics Letters"
DOI: 10.1016/j.cplett.2020.137290
Abstract: Abstract Lithium-6 and lithium-7 with high abundance can be used in fusion (6Li > 30%) and fission (7Li > 99.9%) respectively. Lithium isotope separation with nature abundance always inspires people's interest. In this work, lithium isotope separation by electromigration… read more here.
Keywords: lithium isotope; electromigration; lithium; isotope separation ... See more keywords
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
Sign Up to like & getrecommendations! Published in 2020 at "Materials Chemistry and Physics"
DOI: 10.1016/j.matchemphys.2020.123680
Abstract: Abstract The fine-pitch and small line width Cu redistribution lines (RDLs) serve as the key factor in achieving high-density advanced fan-out packaging products. However, the dimension scaling of the next generation Cu RDL will cause… read more here.
Keywords: fine pitch; current density; high current; electromigration ... See more keywords
Pronounced electromigration of GaInSn/Cu interconnects under super low critical current density
Sign Up to like & getrecommendations! Published in 2021 at "Materials Letters"
DOI: 10.1016/j.matlet.2021.130137
Abstract: Abstract Ga-based alloys has been paid increasingly attention as a promising material choice for constructing flexible and stretchable electronics. The interfacial stability of non-bonding GaInSn/Cu interconnect plays a critical role in determining its electrical performance.… read more here.
Keywords: electromigration gainsn; gainsn; current density; critical current ... See more keywords
An observation and explanation of interior cracking at the interface of solder by electromigration
Sign Up to like & getrecommendations! Published in 2019 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2019.04.013
Abstract: Abstract The electromigration (EM) of a solder joint under high-current stressing causes damage and reduces its service life. Previous studies have suggested that EM-induced cracks typically initiate at the cathode corner where the electron current… read more here.
Keywords: explanation interior; solder; interface; electron current ... See more keywords