Pronounced electromigration of GaInSn/Cu interconnects under super low critical current density
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DOI: 10.1016/j.matlet.2021.130137
Abstract: Abstract Ga-based alloys has been paid increasingly attention as a promising material choice for constructing flexible and stretchable electronics. The interfacial stability of non-bonding GaInSn/Cu interconnect plays a critical role in determining its electrical performance.… read more here.
Keywords: electromigration gainsn; gainsn; current density; critical current ... See more keywords