Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2017.01.292
Abstract: Abstract The rapid accumulation of the Cu 6 Sn 5 phase at the anode is one of the major electromigration-induced phenomena characterizing solder interconnections; however, the outcome of the growth mode has always been conflated… read more here.
Keywords: transition; growth mode; type; electromigration induced ... See more keywords
A theoretical analysis to current exponent variation regularity and electromigration-induced failure
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Applied Physics"
DOI: 10.1063/1.4975348
Abstract: The electric current exponent, typically with j−n form, is a key parameter to predict electromigration-induced failure lifetime. It is experimentally observed that the current exponent depends on different damage mechanisms. In the current research, the… read more here.
Keywords: variation regularity; current exponent; electromigration induced; exponent variation ... See more keywords
Phase-field simulations of electromigration-induced defects in interconnects with non-columnar grain microstructure
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Applied Physics"
DOI: 10.1063/1.5145104
Abstract: In this work, we utilize a phase-field model to investigate electromigration-mediated defects in non-columnar polycrystalline interconnects. We find that the misalignment of the grain boundary with respect to an externally applied electric field governs the… read more here.
Keywords: non columnar; induced defects; phase field; electromigration induced ... See more keywords