Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
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DOI: 10.1038/s41598-017-06250-8
Abstract: In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and the 3D laminography imaging technique was employed for in-situ observation of the microstructure evolution during testing. We found that discrete voids nucleate, grow… read more here.
Keywords: void formation; electromigration mechanism; current density; solder ... See more keywords