Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint
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DOI: 10.1007/s11664-020-08514-y
Abstract: Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced significantly. This trend currently leads to an increased amount of current density… read more here.
Keywords: oriented failure; flip chip; electromigration; electromigration oriented ... See more keywords