Light enhanced direct Cu bonding for advanced electronic assembly
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DOI: 10.1007/s10854-018-9547-5
Abstract: An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnetic radiation exposure on faying… read more here.
Keywords: electronic assembly; enhanced direct; direct bonding; light enhanced ... See more keywords