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Published in 2021 at "Optik"
DOI: 10.1016/j.ijleo.2021.167298
Abstract: Abstract The surface mount technology (SMT) has allowed to include more electronic components with different shapes and sizes on printed circuit boards (PCB), improving the storage capabilities, transmission rates, and data processing; also, some optical…
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Keywords:
distribution;
variable irradiation;
electronic components;
focused infrared ... See more keywords
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Published in 2022 at "Waste management"
DOI: 10.1016/j.wasman.2022.01.019
Abstract: Waste printed circuit boards (WPCBs) contain valuable material resources and hazardous substances, thereby posing a challenge for sustainable resource recovery and environmental protection initiatives. Overcoming this challenge will require mapping the toxic footprint of WPCBs…
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Keywords:
footprint;
toxic footprint;
printed circuit;
circuit boards ... See more keywords
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Published in 2022 at "High Performance Polymers"
DOI: 10.1177/09540083221112307
Abstract: Fused Deposition Modeling (FDM) is one of the most efficient and frequently used methods for the development of biomedical implants, bio-sensors, and customized products. In the FDM process, the filament made of polymers or composites…
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Keywords:
copper;
polymer;
electronic components;
nylon ... See more keywords
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Published in 2017 at "Energies"
DOI: 10.3390/en10081111
Abstract: Electrical and electronic components are very important subcomponents in modern industrial wind turbines. Complex multimegawatt wind turbines are continuously being installed both onshore and offshore, continuously increasing the demand for sophisticated electronic and electrical components.…
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Keywords:
electrical electronic;
optimal dynamic;
electronic components;
dynamic analysis ... See more keywords
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Published in 2023 at "Micromachines"
DOI: 10.3390/mi14040876
Abstract: The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can…
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Keywords:
injection;
study force;
electronic components;
force curves ... See more keywords
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Published in 2018 at "Powder Technology"
DOI: 10.5772/intechopen.76881
Abstract: This chapter proposed a patterning process for ceramic electronic components. The proposed process uses a photoresist, and it is combined with the photolithography process and the printing process. By using both technologies, a high-aspect-ratio and…
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Keywords:
pattern;
ceramic electronic;
sheet;
process ... See more keywords