A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package
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DOI: 10.1109/access.2025.3551884
Abstract: In this study, we identify the origin of electronic flame-off (EFO) errors based on the type of rinse applied for the surface treatment of gold (Au) wires in the wire-bonding semiconductor packaging process. Hydrocarbon and… read more here.
Keywords: rinse; wire; surface; electronic flame ... See more keywords