Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method
Sign Up to like & getrecommendations! Published in 2020 at "Experimental Mechanics"
DOI: 10.1007/s11340-019-00571-7
Abstract: Residual deformation evaluation of underfill (UF) materials in flip chips is crucial to improve the reliability of electronic packages. In this study, we propose to evaluate the residual thermal strain distributions using an inverse method… read more here.
Keywords: temperature; strain distributions; method; residual thermal ... See more keywords
Effect of thermal misfit stress on steam-driven delamination in electronic packages
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DOI: 10.1016/j.engfracmech.2018.03.008
Abstract: Abstract In this study, circular interfacial defects or delaminations between the die-attach layer and the substrate in electronic packages are analytically modeled to investigate the effect of thermal misfit stress on the steam-driven delamination during… read more here.
Keywords: driven delamination; steam driven; stress; electronic packages ... See more keywords
Towards virtual twin for electronic packages in automotive applications
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DOI: 10.1016/j.microrel.2021.114134
Abstract: Abstract The piezoresistive silicon based stress sensor has the potential to be part of the Digital Twin implementation in automotive electronics. One solution to enforce reliability in digital twins is the use of Machine Learning… read more here.
Keywords: electronic packages; delamination; stress; towards virtual ... See more keywords
Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages using Tensor Train Decomposition
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DOI: 10.1109/access.2022.3170455
Abstract: As laptops get thinner and thinner, the electronic packages that go into these devices must shrink along the z-dimension as well. High warpage in these ultra-thin packages is the result of mismatch of coefficients of… read more here.
Keywords: electronic packages; warpage; ultra thin; warpage inverse ... See more keywords
TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages
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DOI: 10.3390/en12061050
Abstract: This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the… read more here.
Keywords: electronic packages; resistance advanced; thermal resistance; advanced calculator ... See more keywords