Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy.
Sign Up to like & getrecommendations! Published in 2022 at "Small"
DOI: 10.1002/smll.202204303
Abstract: The sharp reduction in size and increase in power density of next-generation integrated circuits lead to electromagnetic interference and heat failure being a key roadblock for their widespread applications in polymer-based electronic packaging materials. This… read more here.
Keywords: mdcf ldh; electronic packaging; mdcf; absorption ... See more keywords
Cu-Ba0.7Sr0.3TiO3 composites for electronic packaging
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-01231-1
Abstract: With the rapid growth of Electronic industries, there is an increasing demand for high-performance electronic packaging materials. In a harsher service environment, the high-temperature performance and thermal cycling stability are required to run the electronic system.… read more here.
Keywords: ba0 7sr0; electronic packaging; composites electronic; 7sr0 3tio3 ... See more keywords
Effect of minor scandium addition on the microstructure and properties of Al–50Si alloys for electronic packaging
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-02444-0
Abstract: Al–50Si alloys for electronic packaging were prepared by gas atomization following hot press sintering, and the influences of adding minor Sc (0.3%) on microstructure and mechanical and thermo-physical properties were studied. The Si phase exhibits… read more here.
Keywords: electronic packaging; alloys electronic; 50si alloy; 50si alloys ... See more keywords
Synthesis and analysis of anodic aluminum oxide-nanopore structure on Al substrates for efficient thermal management in electronic packaging
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-03507-3
Abstract: Increased heat generated in high-density electronic devices has intensified the search for advanced thermal management solutions. This urge has prompted various studies in thermal pad, liquid thermal interface material, gap fillers, and thermal coating, etc.,… read more here.
Keywords: anodic aluminum; electronic packaging; oxide nanopore; aluminum oxide ... See more keywords
Technological aspects of silver particle sintering for electronic packaging
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DOI: 10.1108/cw-10-2017-0060
Abstract: Purpose This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging. Design/methodology/approach Based on the literature and author’s own experience, the… read more here.
Keywords: electronic packaging; aspects silver; particle sintering; technological aspects ... See more keywords
CoSn3 Intermetallic Nanoparticles for Electronic Packaging
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DOI: 10.3390/nano12224083
Abstract: At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn3 is a strong nucleating agent of Sn crystal, which has potential application value in… read more here.
Keywords: cosn3 intermetallic; cosn3; growth; electronic packaging ... See more keywords
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
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DOI: 10.3390/polym14142950
Abstract: In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine… read more here.
Keywords: aln hybrid; hybrid filler; highly thermally; electronic packaging ... See more keywords