Comparisons between heat pipe, thermoelectric system, and vapour compression refrigeration system for electronics cooling
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DOI: 10.1016/j.applthermaleng.2018.09.120
Abstract: Abstract Passive systems such as air for electronics cooling have now effectively reached their limits. This paper evaluated three comparable systems for electronics cooling, including heat pipe (HP, passive system), thermoelectric (TE) and vapour compression… read more here.
Keywords: vapour compression; system; compression refrigeration; electronics cooling ... See more keywords
Miniature vapor compression refrigeration system for electronics cooling
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DOI: 10.1016/j.csite.2018.100365
Abstract: Abstract A miniature vapor compression refrigeration system using R134a is investigated for electronics cooling. The system consists of four main components: an evaporator, a compressor, a capillary tube, and a condenser. The evaporator is a… read more here.
Keywords: system; vapor compression; refrigeration system; compression refrigeration ... See more keywords
Experimental investigation of a confined flat two-phase thermosyphon for electronics cooling
Sign Up to like & getrecommendations! Published in 2018 at "Experimental Thermal and Fluid Science"
DOI: 10.1016/j.expthermflusci.2018.01.018
Abstract: Abstract A novel type of two-phase heat spreader based on a flat confined thermosyphon is proposed for electronics cooling applications. Two wickless flat copper-water heat pipes with an inner thickness of 3 mm were experimentally investigated… read more here.
Keywords: experimental investigation; two phase; thermosyphon; electronics cooling ... See more keywords