Characterization of Multiple Commercial Sintered-Silver Pastes as Die Attachment for Power Electronics Packaging: Materials, Processing, and Properties
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DOI: 10.1109/jestpe.2024.3495815
Abstract: The low-temperature sintered-silver joining has emerged as an advanced die attachment technology for power electronics packaging. However, the industry still has great misgivings to completely adopt this technology. One of the barriers includes the confusion… read more here.
Keywords: power electronics; die attachment; sintered silver; electronics packaging ... See more keywords