Evaluation of tensile stress-strain curve of electroplated copper film by characterizing indentation size effect with a single nanoindentation
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DOI: 10.1007/s12540-017-6461-y
Abstract: Nanoindentation has been widely used to measure mechanical properties for instance elastic modulus and hardness due to relatively simple sample preparation and experimental procedure. Primary limitation of nanoindentation is that it does not measure quantitative… read more here.
Keywords: strain; stress strain; electroplated copper; nanoindentation ... See more keywords
Composite protective effect of benzotriazole and 2-mercaptobenzothiazole on electroplated copper coating
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DOI: 10.1039/d2ra05411f
Abstract: Benzotriazole (BTAH) and 2-mercaptobenzothiazole (MBT) are mixed to passivate electroplated copper coatings. The growth process of passive films is comprehensively analyzed from the surface potential, microstructure and chemical composition by potential–time curve, FESEM and XPS.… read more here.
Keywords: electroplated copper; copper coatings; copper; mbt ... See more keywords
The Impact of Substrate Temperature on the Adhesion Strength of Electroplated Copper on an Al-Doped ZnO/Si System
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DOI: 10.3390/ma17204953
Abstract: This research, which involved a comprehensive methodology, including depositing electroplated copper on a copper seed layer and Al-doped ZnO (AZO) thin films on textured silicon substrates using DC magnetron sputtering with varying substrate heating, has… read more here.
Keywords: copper; electroplated copper; temperature; adhesion strength ... See more keywords