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Published in 2022 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2021.161852
Abstract: Abstract Solid-liquid interdiffusion (SLID) bonding is one of the most promising novel methods for micro-(opto)-electromechanical system (MEMS/MOEMS) wafer-level packaging. However, the current SLID bonding solutions require the use of an electrochemical deposition method for MEMS/MOEMS…
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Keywords:
electroplated silicon;
contact electroplated;
evolution;
liquid interdiffusion ... See more keywords