Sign Up to like & get
recommendations!
3
Published in 2023 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2022.3189102
Abstract: In this article, a novel and improved method of the IGBT junction temperature computations in the PLECS simulation software is presented. The developed method aims at accuracy of the junction temperature computations in PLECS by…
read more here.
Keywords:
software;
high frequency;
electrothermal modeling;
modeling high ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2025 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2024.3514492
Abstract: The reliability of power converters is intricately tied to the variations in the junction temperature of semiconductor devices. Therefore, possessing accurate models of these components is of paramount importance. This research introduces an electrothermal model…
read more here.
Keywords:
verification electrothermal;
converters experimental;
electrothermal modeling;
based converters ... See more keywords