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Published in 2020 at "Engineering Failure Analysis"
DOI: 10.1016/j.engfailanal.2020.105016
Abstract: Abstract The transient response of a piezoelectric layer bonded to an orthotropic layer under anti-plane mechanical and in-plane electrical impacts is investigated in this paper. The problem consist of two parts. In the first part,…
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Keywords:
interface cracks;
analysis;
dislocation;
embedded interface ... See more keywords