Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging
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DOI: 10.1109/jestpe.2019.2952238
Abstract: In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance… read more here.
Keywords: pcb; embedded package; power; fan panel ... See more keywords