Effect of Grain Size on Formability and Deformation Mechanism of High‐Purity Aluminum during Micro‐Embossing Process at Elevated Temperature
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DOI: 10.1002/adem.201900690
Abstract: Due to the high processing efficiency, the low manufacturing cost, and the emission of carbon dioxide, microforming attracts considerable attention in the field of microelectromechanical systems. Thus, the micro‐embossing process is carried out for the… read more here.
Keywords: pure; temperature; formability; embossing process ... See more keywords
Thermal influence on the mechanical properties of cardboard during an ultrasonic-assisted embossing process
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DOI: 10.15376/biores.15.3.5110-5121
Abstract: During the embossing process, a fiber sandwich is compressed between embossing tools. The use of ultrasound causes a short-term increase in the material temperature in addition to causing plastic deformation. The combination of the material… read more here.
Keywords: embossing process; properties cardboard; mechanical properties; temperature ... See more keywords