Enhancement of Cu pillar bumps by electroless Ni plating
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DOI: 10.1016/j.mee.2017.05.055
Abstract: Abstract Cu pillar bumps were mechanically enhanced using electroless Ni plating for fine-pitch electronic packaging applications. The interfacial reaction and mechanical properties of the Ni-plated Cu pillar bump joints were evaluated. After reflowing, the plated… read more here.
Keywords: electroless plating; enhancement pillar; bumps electroless; pillar bumps ... See more keywords