Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl
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DOI: 10.1007/s10854-017-7806-5
Abstract: The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of operating circuits and results in shorts (dendrites) between adjacent conductor lines/traces. Dendrite growth occurs as a result of metal ions… read more here.
Keywords: enig surface; surface; electrochemical migration; test ... See more keywords