The development of estimated methodology for interfacial adhesion of semiconductor coatings having an enormous mismatch extent
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DOI: 10.1016/j.apsusc.2017.12.189
Abstract: Abstract The long-term reliability of multi-stacked coatings suffering the bending or rolling load was a severe challenge to extend the lifespan of foregoing structure. In addition, the adhesive strength of dissimilar materials was regarded as… read more here.
Keywords: methodology; estimated methodology; multi stacked; mismatch ... See more keywords