Electrical field-induced faceting of etched features using plasma etching of fused silica
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DOI: 10.1063/1.4991706
Abstract: This paper reports a previously unreported anomaly that occurs when attempting to perform deep, highly anisotropic etches into fused silica using an Inductively-Coupled Plasma (ICP) etch process. Specifically, it was observed that the top portion… read more here.
Keywords: fused silica; highly anisotropic; using plasma; plasma etching ... See more keywords