Vapor etching to avoid micro-masking by gas-bubbles in wet release of MEMS
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DOI: 10.1088/1361-6439/acd25d
Abstract: We report on the formation of gas bubbles during the release of MEMS devices using buffered oxide etch. Several approaches to mitigate the problem are proposed and tested together with a qualitative study of the… read more here.
Keywords: release mems; etching avoid; vapor etching; gas bubbles ... See more keywords