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Published in 2017 at "Journal of Applied Physics"
DOI: 10.1063/1.4991706
Abstract: This paper reports a previously unreported anomaly that occurs when attempting to perform deep, highly anisotropic etches into fused silica using an Inductively-Coupled Plasma (ICP) etch process. Specifically, it was observed that the top portion…
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Keywords:
fused silica;
highly anisotropic;
using plasma;
plasma etching ... See more keywords