An All-Silicon Resonant Pressure Microsensor Based on Eutectic Bonding
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DOI: 10.3390/mi14020441
Abstract: In this paper, an all-Si resonant pressure microsensor based on eutectic bonding was developed, which can eliminate thermal expansion coefficient mismatches and residual thermal stresses during the bonding process. More specifically, the resonant pressure microsensor… read more here.
Keywords: resonant pressure; microsensor; cap; eutectic bonding ... See more keywords
Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers
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DOI: 10.3390/mi8050158
Abstract: Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex… read more here.
Keywords: bonding; eutectic bonding; wafer bonding; mems accelerometer ... See more keywords