Surface and transport properties of liquid Ag–Sn alloys and a case study of Ag–Sn eutectic solder
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9897-z
Abstract: This review represents the state of the art in the thermophysical properties of liquid Ag–Sn alloys highlighting the surface and wetting properties of Ag–Sn eutectic solder. It includes an atomistic approach developed within the framework… read more here.
Keywords: surface; properties liquid; solder; eutectic solder ... See more keywords
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
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DOI: 10.1007/s11664-020-08595-9
Abstract: Ag (2.0 wt.%) and In (1.5 wt.%) were alloyed into Sn-58Bi eutectic solder, and the individual and combined influences of Ag and In on the microstructure, microhardness, and impact toughness of the SnBi solder were investigated. The… read more here.
Keywords: snbiagin; snbi solder; solder; eutectic solder ... See more keywords
Performance comparison of two metallic eutectic solder based medium-temperature domestic thermal energy storage systems
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DOI: 10.1016/j.energy.2019.116828
Abstract: In this study, two thermal energy storage systems based on eutectic solder (Sn63/Pb37) metallic phase change material (PCM) are compared experimentally during their charging and discharging cycles. The first system is a single-PCM system composed… read more here.
Keywords: storage; system; energy; eutectic solder ... See more keywords
Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys
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DOI: 10.3139/146.111851
Abstract: Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys.… read more here.
Keywords: solder alloy; melting point; solder; eutectic solder ... See more keywords
A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
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DOI: 10.3390/mi13060867
Abstract: We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is… read more here.
Keywords: solder; low temperature; eutectic solder; solder assembly ... See more keywords