Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers
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DOI: 10.3390/mi8050158
Abstract: Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex… read more here.
Keywords: bonding; eutectic bonding; wafer bonding; mems accelerometer ... See more keywords