Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
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DOI: 10.1007/s11664-018-6744-1
Abstract: The reliability of solder joints is affected significantly by thermomechanical properties such as creep and thermal fatigue. In this work, the creep of directionally solidified (DS) Sn-3Ag-0.5Cu wt.% (SAC305) dog-bone samples (gauge dimension: 10 × 2 × 1.5 mm) with… read more here.
Keywords: 3ag 5cu; evaluating creep; deformation; solder ... See more keywords